India’s semiconductor ambitions got a fresh boost with the signing of a tripartite memorandum of understanding between the Odisha government, Intel Corporation and US-based 3D Glass Solutions Inc (3DGS) on May 29 to establish an advanced packaging glass core substrate manufacturing facility in the state. The development comes as India sharpens its focus on strategic technologies, including semiconductors, artificial intelligence and electronics manufacturing, amid rising geopolitical competition and growing demand for resilient global supply chains.
The proposed project, to be located in the Bhubaneswar-Khurda region, entails an estimated investment of about $3.3 billion, making it among the country’s largest investments in high-technology manufacturing.
The agreement was signed in the presence of Electronics and IT minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi, Intel chief executive Lip-Bu Tan and senior industry executives. Vaishnaw said the agreement aligned with the Centre’s broader strategy of developing a complete semiconductor manufacturing ecosystem in the country. He said the participation of global technology firms reflected growing industry confidence in India’s semiconductor push under the India Semiconductor Mission.
The minister cited recent investments and partnerships involving global semiconductor equipment and materials companies such as Applied Materials, Lam Research, Tokyo Electron and Merck, along with Tata Electronics’ collaboration with Dutch chip equipment maker ASML, as evidence of rising momentum in the sector.
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