Odisha is seeking to attract at least three more semiconductor companies involved in outsourced semiconductor assembly and test (OSAT) and assembly, testing, marking and packaging (ATMP) as it works to build a wider chip manufacturing ecosystem under the Centre’s Semicon 2.0 programme, a MoneyControl report stated.
The state is also targeting printed circuit board manufacturers and companies working with gallium nitride and silicon carbide, focusing on specialised parts of the semiconductor supply chain rather than competing directly for large silicon wafer fabrication plants.
Additional Chief Secretary for Industries and Home Hemant Sharma said Odisha sees an opportunity in projects requiring investments of between Rs 100 crore and Rs 500 crore.
“If we target fab, we may not be successful, but if we target this mid segment, the sweet spot is, let’s say, about Rs 100 crore to Rs 500 crore,” Sharma was quoted as saying by MoneyControl.
According to the state government, six semiconductor projects with a combined cost of Rs 14,795 crore are being developed in Odisha.
