Odisha has five semiconductor projects in the pipeline involving proposed investments of more than $4 billion as the state steps up efforts to establish a foothold in the global chip manufacturing and advanced electronics value chain.
The projects, which span semiconductor fabrication and advanced 3D chip packaging, are expected to mark a significant shift in Odisha’s industrial landscape, traditionally dominated by mining, metals and mineral-based industries.
Speaking at the inauguration of TiECon Bhubaneswar 2026 on Friday, Vishal Kumar Dev, additional chief secretary (ACS) of the Electronics and Information Technology Department, said two of the 12 projects approved under the India Semiconductor Mission are coming up in Odisha.
“India’s first compound semiconductor fabrication unit and the first advanced 3D chip packaging unit are being built in the state at speed, with groundbreaking conducted within six to eight months of the approval,” he said.
Dev said Odisha is moving from a mine-based economy to a mind-based economy, with a strong emphasis on building future-ready infrastructure in semiconductors, AI data centres and global capability centres (GCCs).
“Advanced chip packaging is the next step and Odisha is taking an edge, among others, in pivoting towards advanced packaging units, especially in glass-core technology. Our collaboration with global companies like Intel and 3D Glass Solutions intends to take the lead in the global semiconductor value chain,” he said.
